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    Press release of GÖPEL electronic GmbH about one platform, one software

    GÖPEL electronic introduces the new Multi Line product family, an innovative platform of inspection systems that supports the entire manufacturing process. The centerpiece of this solution is a modular base system with a uniform and powerful software interface. This reduces training requirements, enables flexible employee scheduling, and optimizes the exchange of knowledge between production staff. This can be especially important when there may be a shortage of skilled workers.

    The all-rounder can be configured for all inspection tasks throughout the entire manufacturing process: for solder paste inspection (SPI), for surface mount technology (SMT) and through-hole technology (THT) automated optical inspection (AOI), and also for conformal coat inspection (CCI). For THT printed circuit board assemblies (PCBA), Multi Line provides flexible transport options, with or without carriers, and all the necessary camera modules for this application. It also allows THT solder inspection, even during return on the optional lower transport conveyor. Thanks to 3D technology, solder joints can be inspected not only for soldering quality and for shorts, but also for solder volume and pin length, without flipping the PCBA.

    The system’s configuration versatility also makes it suitable for use in the SMT process, where optional double-sided inspection offers the advantage of fully testing SMT assemblies without flipping the PCBA.

    Furthermore, Multi Line is available as an SPI system for the inspection of solder paste deposits in regard to shape, height, area, bridges, volume, X/Y offset, and co-planarity. A closed-loop interface to the solder paste printer is available, and a link to PILOT Verify software makes fault analysis more efficient by displaying associated AOI, AXI, and SPI result data.

    Multi Line CCI can automatically inspect protective coatings by making fluorescent coatings glow using UV LEDs of different wavelengths. With telecentric optics and a color camera, the system delivers high-contrast images and enables fast programming using CAD data and coating plans. As a special feature, the PCBA can be simultaneously inspect both top and bottom without turning, and, if necessary, can also be transported back to the beginning of the line using a lower level return conveyor.

    Thanks to the modular design of the Multi Line platform, camera modules can be flexibly combined and, if necessary, retrofitted later for new applications in the manufacturing process.

    With this comprehensive solution, GÖPEL electronic is utilizing its many years of experience in quality assurance and setting new standards in inspection technology for the electronics manufacturing process.

    GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies as well as industrial and automotive electronics systems. GÖPEL electronic is comprised of four business units:

    • Automotive Test Solutions
    • Embedded JTAG Solutions
    • Inspection Solutions AOI-AXI-SPI-IVS
    • Industrial Function Test

    The company is a global supplier with its own subsidiaries as well as distribution, and generated sales of approximately 40 million Euros in 2023 with 240 employees.

    Further information: www.goepel.com/en

     

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