Leti, an institute of CEA-Tech, will present five invited papers, 21 in total (20 oral papers and 1 poster), at Photonics West 2020 in San Francisco, Feb. 1-6. In addition, its teams will introduce the institute’s latest transfer-ready solutions for all-wavelength imaging, information display systems, light-emissive components, optical data communications, optical sensors, and other advances at the French Pavilion in booth 857A, Moscone Center, during the event.
CEA-Leti also will host a workshop and networking-cocktail reception for invited guests beginning at 5:15 p.m., Feb. 5, at the W San Francisco hotel. Presentations at the event will include a keynote entitled “Working backwards from the customer to the sensor” by Pat Tang, vice president of hardware technology and machine learning at Amazon Lab126 in Sunnyvale, Calif. The workshop, which will focus on disruptive photonics concepts for new applications and markets, will begin with introductions by Emmanuel Sabonnadière, CEA-Leti CEO, and Agnès Arnaud, head of the institute’s Optics & Photonics Division.
Workshop topics include:
- New miniature sensors of particulate matter using angular spectral imaging, Laurent Duraffourg CEA-Leti’s photonics sensors lab manager
- Toward miniaturized solid-state Lidar using the convergence between silicon photonics & electronics, Francois Simoens, CEA-Leti, executive strategic program manager
- Computational microscopy, Cédric Allier CEA-Leti, Ph.D. project manager, live cell imaging
- Low-loss silicon photonics platform for quantum technologies, Eleonore Hardy, CEA-Leti, business developer, silicon photonics
On Feb. 4-6 in booth #857A, CEA-Leti’s multidisciplinary optics-and-photonics teams will demonstrate their advances in several technologies, including:
• NeoLed: compact, low-cost & long-lifespan, distributed-switch LEDs.
• LensFree: an imaging technology for point-of-care analysis and pathology screening.
• LiFi-multicell: the world’s first smart orchestrator for interference-free LiFi networks.
• Pixcurve: technology that makes imaging or photographic products lighter and more compact.
• Photonic sensors: toward low-cost on-chip chemical sensors.
• Silicon photonics: design, manufacturing, testing & packaging solutions.
In addition, Scintil, a startup of CEA-Leti, will present its silicon photonic circuits with wafer-level integrated lasers at the booth.
CEA-Leti will present major scientific results this year at the BiOS and OPTO conferences. Among the 21 papers:
BiOS CONFERENCE
11225-4 Clinical and Translational Neurophotonics 2020
Saturday, Feb. 1
Session 2 10:40 AM to 11:40 AM — Optical Spectroscopy: Pre-Clinical II
Error-propagation approach to design of a CW NIRS instrument for deep layer measurements: neonate head application
11225-5 Clinical and Translational Neurophotonics 2020
Saturday, Feb. 1
Session 2 10:40 AM to 11:40 AM — Optical Spectroscopy: Pre-Clinical II
Accurate identification of the superficial layer for a NIRS short-channel approach: neonate cerebral oximetry application
11249-39 Quantitative Phase Imaging VI
Monday, Feb. 3
Session 11 1:40 PM to 3:00 PM — QPI Algorithms I
Alternation of inverse problem and deep learning approaches for phase unwrapping in lens-free microscopy
11223-13 Photonic Diagnosis, Monitoring, Prevention, and Treatment of Infections and Inflammatory Diseases 2020
Monday, Feb. 3
Session 3 1:30 PM to 3:20 PM — Photonic Diagnosis III
Phage susceptibility testing with lensless imaging technique
11243-26 Imaging, Manipulation, and Analysis of Biomolecules, Cells, and Tissues XVIII
Tuesday, Feb. 4
Session 7 1:20 PM to 3:30 PM — Cytomics II
A simple, compact and robust phase and fluorescence microscope for cell cycle study
OPTO CONFERENCE
11276-5 Optical Components and Materials XVII
Tuesday, Feb. 4
Session 2 10:30 AM to 11:50 AM – Optical Modulators
Franz-Keldysh modulation in GeSn-based heterostructures
11280-6 Gallium Nitride Materials and Devices XV
Tuesday, Feb. 4
Session 1 10:30 AM to 12:30 PM — Growth I: Bulk Growth and Epitax
Gallium pollution in an AIXTRON close coupled showerhead reactor and its serious effect on the growth process stability of InGaN layers for optoelectronic applications
11280-46 Gallium Nitride Materials and Devices XV
Thursday, Feb. 6
Session 9 11:15 AM to 12:30 PM — MicroLED and Nanostructured Devices I
X-ray photoelectron spectroscopy analysis of InGaN surfaces after chemical treatments and atomic layer deposition of Al2O3 thin films: application to μLED
11284-13 Smart Photonic and Optoelectronic Integrated Circuits XXII
Monday, Feb. 3
Session 3 3:45 PM to 6:35 PM — Integration, Manufacturing and Photonic Circuits
Immersion lithography introduction in Si photonics platform (Invited Paper)
11284-38 Smart Photonic and Optoelectronic Integrated Circuits XXII
Wednesday, Feb. 5
Session 8 8:00 AM to 10:05 AM — Mid-Infrared Optoelectronics I
Ge platforms for mid-infrared applications (Invited Paper)
11284-56 Smart Photonic and Optoelectronic Integrated Circuits XXII
Wednesday, Feb. 5
Session 11 4:50 PM to 6:20 PM — Control, Manipulation, and Detection of Photons
Wideband Si/Sin polarization splitter/rotator simulations for standard datacom integrated photonic circuit
11285-9 Silicon Photonics XV
Monday, Feb. 3
Session 2 2:00 PM to 3:30 PM — Optical Communications I
Advanced Si photonics platform for high-speed and energy-efficient optical transceivers for datacom
11285-30 Silicon Photonics XV
Tuesday, Feb. 4
Session 6 4:10 PM TO 5:50 PM — Ge/Si Integration
Impact of carrier confinement on the emission of mid-infrared GeSn heterojunction LEDs
11285-37 Silicon Photonics XV
Wednesday, Feb. 5
Session 8 11:00 AM TO 12:30 PM — Optical Detection and Sensing I
Micro PA detector: pushing the limits of mid IR photoacoustic spectroscopy integrated on silicon (Invited Paper)
11285-39 Silicon Photonics XV
Wednesday, Feb. 5
Session 8 11:00 AM TO 12:30 PM — Optical Detection and Sensing I
High-speed integrated waveguide lateral Si/Ge/Si photodiodes with optimized transit time
11287-24 Photonic Instrumentation Engineering VII
Wednesday, Feb. 5
Session 6 3:50 PM to 5:30 PM — Sensors and Ruggedized Systems I
Millimeter-sized particle sensor using a wide FoV monolithic lens assembly for light scattering analysis in Fourier domain
11287-25 Photonic Instrumentation Engineering VII
Wednesday, Feb. 5
Session 6 3:50 PM to 5:30 PM — Sensors and Ruggedized Systems I
Resonant optomechanical transduction for photoacoustic detection,
11287-43 Photonic Instrumentation Engineering VII
Thursday, Feb. 6
Session 10 3:30 PM to 5:00 PM — Photonic Instrumentation for Consumer Applications
A miniaturized optical sensor for particulate matter counting and classification
11288-7 Quantum Sensing and Nano Electronics and Photonics XVII
Sunday, Feb. 1
Session 3 1:30 PM TO 3:05 PM — Quantum Cascade Lasers I
Enabling low-cost QCL by large scale fabrication on CMOS pilot line (Invited Paper)
11290-24 High Contrast Metastructures IX
Tuesday, Feb. 4
Session 6 3:40 PM TO 5:40 PM — Metasurface/Metastructure: Design and Topological Concept
Efficient pixel-by-pixel optimization of silicon photonic devices (Invited Paper)
11302-70 Light-Emitting Devices, Materials, and Applications XXIV
Posters
Wednesday, Feb. 5 6:00 PM to 8:00 PM
Characterization of micro-pixelated InGaP/AlGaInP quantum well structures
For more information, visit www.leti-cea.com
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